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高精度立式平面研磨拋光機YH2M13B-9L配有安全自鎖氣缸,當上研磨(拋光)盤上升到上限位點時,插板伸出,防止上研磨(拋光)盤落下,確保操作者、設備安全。
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高精度立式平面研磨拋光機YH2M13B-9L主要用途:The main purposes:
本設備主要用于硅片、藍寶石晶體、陶瓷片、光學玻璃、石英晶體、手機屏幕玻璃、其它半導體材料等非金屬和金屬的硬脆性材料薄形精密零件的上、下兩平行端面的同時研磨和拋光。
This equipment is mainly used for lapping and polishing both sides of the parallel surface of thin metal and hard brittle nonmetal parts, such as silicon, sapphire crystal, ceramic, optical glass, quartz crystal and other semiconductor materials.
高精度立式平面研磨拋光機YH2M13B-9L技術特點:Technical characteristics:
1.本機屬于四道行星輪系運動原理的研磨(拋光)機床。
2.本機采用內齒圈升降方式。升降氣缸推動螺旋凸輪帶動齒圈升降。升降氣缸由裝在設備右側的三位手動閥控制,齒圈的行程可以調節(jié).
3.本機采用雙電機拖動。主電機通過一系列變速帶動上磨盤、下磨盤、內齒圈轉動。而太陽輪則由副電機帶動。主電機與副電機均為變頻調速。下磨盤、內齒圈、太陽輪轉動方向*,上磨盤則做相反轉動。
4.本機配有安全自鎖氣缸,當上研磨(拋光)盤上升到上限位點時,插板伸出,防止上研磨(拋光)盤落下,確保操作者、設備安全。
5.本機采用PLC控制,控制方式靈活可靠。
6.本機采用觸摸屏作為人機界面顯示報警和機床狀態(tài)的實時信息,界面友好,信息量大。
1.The machine is according to four planetary gears motion principle.
2.This machine adopts the way of the inner gear ring lifting. The cylinder pushes spiral cam to drive the ring gear lift when it ups and downs. It is controlled by a three manual valve device which is installed in the right side. The gear ring can be adjusted.
3.Double motor driving. The main motor drives the upper lapping plate, the lower lapping plate and the inner gear ring to rotate by a series of variable speed, And the sunwheel is driven by the auxiliary motor. Both the main motor and the auxiliary motor are frequency conversion. The lower lapping plate, inner ring gear and the sun wheel rotate in the same direction, but the upper lapping plate opposite.
4.The machine is equipped with safety lock cylinder, when the upper lapping rises to the up limitation, the inserting plate comes out to prevent it falling down so that ensure the operator and equipment safety.
5.PLC control is flexible and reliable.
6.It adopts touch screen as man-machine interface device, which displays the alarm and in real time information of machine status, it is very friendly and with large amount of information.
YH2M13B-9L技術參數(shù):Technical spec:
項目 Item | YH2M13B-9L |
研磨盤尺寸Lapping plate size(外徑ODx內徑IDx厚度THK)(mm) | φ978xφ558x45 |
行星輪規(guī)格Planetary wheel spec | DP=12 Z=108 |
放置行星輪個數(shù)n Planetary Wheel Qty | 3≤n≤9 |
加工件zui大尺寸(mm)The max workpiece size | 200(矩形對線Rectangle diagonal 200mm) |
加工件zui小厚度尺寸(mm)The min THK | 0.4 |
研磨件zui高平面度(mm)Lapping workpice flatness | ≤0.008mm(φ200) |
拋光件zui高平面度Polishing workpice flatness | ≤0.005mm(φ200) |
研磨件表面粗糙度Lapping workpice roughness | ≤Ra0.15μm |
拋光件表面粗糙度Polishing workpiece roughness | ≤Ra0.125μm |
外形尺寸(約:長x寬x高)Size(L*W*H)(mm) | 1650x1300x2650 |
整機重量(約)Weight(Kg) | 2600 |